DiTEC Polishing Compound - Fine Cut - 32oz

Availability: In Stock

Polishing Compound - Fine Cut - 32oz

This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

Features:

• Effectively removes holograms
• Free of solvents and silicone
• Appearance: Cream/Paste
• Solubility: N/A
• pH: 8

Use & Application:

For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

Specifications

Manufacturer Part Number	PC-CMPD-FCO2
UPC	850019168440
Shipping Weight	2.35 lb
Accessories by Manufacturer #	PP-UFCT-1501|PP-UFCT-1751|PP-FNCT-1501|PP-FNCT-1751

Videos

• Video 1

For current availability, ordering support, and product assistance, visit EquipTestPro.com.